Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Viola Eckelt Am Umfang des Kapitels 3

Am Umfang des Kapitels 3 zeigt sich

2 Qualifikationsstruktur

nanokleinen Außerirdischen

Der letzte Teil entwickelt ein Bewertungsschema anhand dessen die Modelle beurteilt werden

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Viola Eckelt Am Umfang des Kapitels 3Benefiting from Thermal and Mechanical Simulation in Micro Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro electronics; the state of the art methodologies for thermal &